SAN MATEO, Calif. — To achieve first-pass timing closure on complex ASICs, designers must ensure their chip architecture design and RTL design are physical synthesis-friendly. That was the bottom-line message delivered Tuesday (Nov. 5) by LSI Logic Corp.'s director of ASIC technical marketing, Jeff Vanderlip, in a presentation at the SoC Online Conference, which is sponsored by EE Times and continues Wednesday.

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SAN MATEO, Calif. — To achieve first-pass timing closure on complex ASICs, designers must ensure their chip architecture design and RTL design are physical synthesis-friendly. That was the bottom-line message delivered Tuesday (Nov. 5) by LSI Logic Corp.'s director of ASIC technical marketing, Jeff Vanderlip, in a presentation at the SoC Online Conference, which is sponsored by EE Times and continues Wednesday.

In a brief statement issued on Thursday, Sendo said only that it has terminated its Smartphone development programme(s) utilising Microsoft Windows for Smartphone 2002 Software. The company added it was a very difficult” decision to take and that having to cancel the Z100 was a setback for the company.

Hugh Brogan, Sendo's chief executive, is quoted as saying the decision was influenced by the use of open standards such as MMS (multimedia messaging) and Java in Nokia's and Symbian's software. The company also stated access to source code allowed by Series 60 was important. With Smartphone 2002, Sendo did not have full access to this.

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Sendo's move is a setback for Microsoft, which has had difficulty convincing handset makers to adopt its software and the restrictions that go along with it. The only other handset maker to have introduced a Smartphone 2002 device is Taiwanese contract manufacturer High Tech Computing (HTC), whose handset will be launched this year by Orange under the brand SPV (Sound Pictures Video). Samsung has also licensed the technology, but has yet to launch a product using Smartphone 2002, and Microsoft says over 50 companies have already developed applications that run on its operating system.

Not surprisingly, Nokia welcomed the move, stressing Series 60 is licensed as source code, allowing users to modify the user interface and make their own additions to the platform. Companies that have already committed the platform include Matsushita, Siemens, Samsung and Nokia itself.

For more information on this story go to www.sendo.com.

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Buss continued: Ferroelectric memory only requires two additional masks which, given its other characteristics, makes it very attractive.” Buss said that in large memory arrays access time was governed by the length and capacitance of the word lines not by underlying materials properties, so he expected access times for FRAM arrasy to come out about the same as their DRAM equivalents.

We believe FRAM has the potential to become an ideal non-volatile memory option for a wide range of applications in the 2005 timeframe,” said Hans Stork, senior vice president and director of TI's silicon technology development. This demonstrates that semiconductor materials research coupled with innovative product design can deliver revolutionary advances, and TI believes FRAM can change the product dynamics in embedded memory.”

The 1.5-volt chips demonstrate the smallest FRAM cells shown-to-date, measuring only 0.54 square micron, TI claimed. At the 90-nm process node, the generation where TI's first embedded FRAM products are expected to appear, the FRAM cells should be 0.35 square microns, the company said.

The ferroelectric capacitor is formed using iridium electrodes and a thin Lead Zirconate Titanate (PZT) ferroelectric layer where the electric polarization is shifted between two stable states by the application of an electric field. The direction of this electric polarization is sensed by internal circuits as either a high or a low logic state. Each orientation is stable and remains in place even after the electric field is removed, preserving the data within the memory without periodic refresh.

Ramtron and TI have worked together on the production of the 64-Mbit FRAM device. While TI is interested in embedded applications Ramtron will focus its use of the jointly developed technology on stand-alone memory products, TI said.

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CHANDLER, Ariz. — Amkor Technology Inc., a provider of contract assembly and test services, has expanded its ability to package image sensors and claims to have 13% of the CMOS image sensor packaging market.

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