AVX Corporation

<p>The work in China comes as operators in the U.S. aim at rolling out 5G as early as next year. The new standard is likely to take over a lot of the telecommunications load that is currently handled by fixed-line technology in residential and manufacturing environments.</p>

But Apple’s adoption of ST’s NIR sensors marks the debut of SOI in mass production for image sensors, noted Cambou. Image sensors are characterized by large surface due to the physical size of light. Therefore, this is a great market to be in for a substrate supplier” like Soitec, he added.

A 2013 whitepaper written by the SIA’s anti-counterfeiting task force cites a 2012 report by IHS iSuppli (now IHS Markit) that found that the five most prevalent types of semiconductor reported as counterfeit represent $169 billion in potential risk per year for the global electronics supply chain.

The main focus of the SIA’s anti-counterfeit task force is to work with government agencies worldwide to educate, train and communicate the risk to health and safety of counterfeit semiconductors. Of course, this kind of awareness raising is like shooting at a moving target as counterfeiters adapt and get more sophisticated.  

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The counterfeiters are definitely getting smarter about how they counterfeit parts,” Maestas said. As we train law enforcement, just like with other criminal activities, they try to find ways around what law enforcement or customer officials may be knowledgeable about.”

For cases like the Ryzen 7 procured on Amazon, the SIA has a simple fix: the SIA and every semiconductor company recommend that semiconductor buyers buy chips only directly from the manufacturer or from their authorized distribution channels.

That’s the way to purchase authentic and reliable parts,” Maestas said.

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—Dylan McGrath is the editor-in-chief of EE Times.

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ERJ3EKF2000V_Datasheet PDF

LONDON — STMicroelectronics has revealed better than expected second quarter results. Net revenues of $1.92 billion were up 5.6 percent sequentially, 12.9 percent year over year.

We are putting together quarters of successive improvement in our financial results. The second quarter delivered further improvement, with strong sequential and year-over-year revenue growth, and with operating income and net income following the same trajectory,” said Carlo Bozotti, STMicroelectronics president and CEO.

—Dylan McGrath is the editor-in-chief of EE Times.

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TAICHUNG, Taiwan – October 24, 2017 — Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustMETM Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture specification.

As the industry’s first Common Criteria EAL5+ certified Secure Flash, and now with the addition of support for the TCG DICE, the TrustMETM W75F Secure Flash provides designers with secure memory solution for Internet of Things (IoT), mobile, artificial intelligence, and other demanding applications that call for a secure root of trust, privacy, authentication, code and data confidentiality.

Asked about specifics of the GSP architecture different from GPUs and DSPs, the company cited its GSP’s abilities to do direct graph processing, on-chip task-graph management and execution, and task parallelism. We believe our GSP can beat the computing engine in any of those processors,” Dinakar Munagala, ThinCI’s CEO, told us.

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