SSI Technologies, Inc.

<p>Another possible setback for NGL–especially for the EPL camp led by Japan's Nikon and IBM–is that EPL may be gearing up for only one device generation, the 45-nm node, according to the survey. The rival EUV tools could end up producing wafers at both the 45- and 32-nm (0.032-micron) device nodes. The 32-nm devices are not expected to hit the market until 2009 or so, according to analysts.</p>

A large part of the credit goes to the Athlon, which was designed virtually from the ground up. Intel was content to tinker with the microarchitecture when designing the Pentium III. As a result, Athlon actually gave AMD a performance advantage when competing for the PC market.

The surface finish is the point in the process after the solder mask has been placed on the board and only copper pads remain. To protect the copper area and prepare the area for soldering, the pad is coated with a thin layer of solder. This is usually done with a hot air solder leveler. Specifying the process is not necessary Hot air solder leveling (HASL) is one of many possible surface finishes. You must find out if it is acceptable for your particular design and assembly process.

Define:

the unit of inductance

Solder should be applied to all exposed copper surfaces.

Process:

Silkscreening is the point where the markings for reference designation and component outline are taken from the design and copied to the board.

the unit of inductance

Define:

A good silkscreen aspect ratio can be found in IPC – 2221 section 4.6: Usually, a minimum character height of 1.5 mm with a line width of 0.3 mm is adequate.” This works out to a .060″ height and .011″ line width for those of us who are metrically challenged.”

the unit of inductance

Black silkscreen should be avoided unless it is being used on bare FR-4, with no solder mask. Typically solder mask is dark and there would not be much contrast with black silkscreen, resulting in difficult or reduced legibility.

Process:

The low power DRAM could change the current DRAM business significantly. Unlike commodity PC memory, for example, the new DRAM will become more customized to meet the different requirements of handset OEMs. In fact, cell phones may be the catalyst for a wave of application-specific DRAMs that will fragment the market, says Mike Despotes, president of Elpida Memory.

(See Aug. 20 story.)

Support for the low-powered, RF networking technology may now be waning, as speculation builds that the highly touted Bluetooth may not be able to compete with the faster 802.11b on the high end or the simpler, low-power alternatives on the low end.

This speculation was reinforced this week by Bluetooth being notable by its absence at the IEEE Rawcon conference in Boston, which focuses on all things wireless. A mere two papers were presented on Bluetooth.

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The EDA industry is characterized by periodic upheavals in technology. Without exception, startups have driven these changes, which have subsequently changed the balance of power in the industry.

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