<p><span style=Toni McConnel can be reached at .

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Hamling has a B.S.E.E. from the University of Michigan, an M.S.E.E. from Stanford University and an MBA from the University of Texas.   Dan’s experience and vast knowledge will make a great impact on our membership and the industry as a whole through the initiatives he will lead within the Test Interest Group.”commented Jodi Shelton, President of GSA.

Total-ACE consolidates protocol, memory, dual transceivers, and dual transformers –all in one small plastic BGA package with direct and/or transformer coupled 1553 connections inside- to simplify MIL-STD-1553 fabrication. Total-ACE provides an interface between a host processor or PCI interface and a MIL-STD-1553 bus.


The introduction of new design collateral enables engineers to reduce their design and validation efforts as well as costs.

Benefits: •    Small Size Saves Board Space •    Simplified Board Design with Single Package System •    Single Part Provides Increased Reliability •    Field Proven & Reliable Technology with over 62 Million Hours of In-Service History •    Qualified and RT Validated to Simplify Qualification •    Lower Total Cost of Ownership •    Software Compatible with ACE, Mini-ACE®, Enhanced Mini-ACE®, Micro-ACE®, and Mini-ACE® Mark3 Series •    RoHS version available •    Direct and Transformer coupled versions available

Total-ACE main features: •    1 Dual Redundant MIL-STD-1553 Channel      o    BC, RT, MT or RT/MT Functionality      o    Direct and/or Transformer Coupled      o    Supports MIL-STD-1553 A/B      o    Supports MIL-STD-1760      o    4K x 16 or 64K x 16 RAM      o    Tx Inhibit Ball for MT Only Applications      o    BC Disable Ball for RT Only Applications      o    Simple System RT Mode •    Small Package:      o    312 Ball BGA (1.1 in. x 0.6 in.) (27.9 mm x 15.2 mm)      o    0.185″ (4.7 mm) Max Height •    Extended Industrial Temperature Range      o    -40°C to +100°C      o    Thermal Balls for Improved Heatsinking •    3.3 Volt Only Operation •    DO-254 Certifiable •    Generic Processor or PCI Interface •    Leaded and RoHS Versions Available •    High-Level C Software Development Kits with Sample Code for Windows®, Linux®, and VxWorks® •    Graphical User Interface to Generate Application C Code


Applications : •    Mission Computers •    Digital Data Recorders •    LRU's •    Radios/Modems •    Displays •    Ground Vehicles •    Commercial Aerospace •    Radar Systems/Situational Awareness

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XP Power has added to the company's range of low power metal cased DC-DC converters with the launch of the 20 Watt JCM20 and JTK20 series. Aimed at space constrained portable applications, these highly efficient board mounted converters provide either single or dual regulated outputs from an ultra compact 25.4 x 25.4 x 9.90 mm (1 x 1 x 0.39 inch) package.

Achieving what XP claims is an industry-leading power density of up to 51 Watts per cubic inch and an efficiency of up to 89% , the units are ideal for applications where PCB space for the converter needs to be kept to the minimum and an industry standard package pinout is required.  The products can replace existing 1 x 2 inch packages thus reducing required board space by 50%.

Chinese fabless firm selects U.S. foundry

Tower swings back to loss in Q1

Tower foundry opens Shanghai office

Tower makes deal to export know-how, equipment


One of the most in interesting aspects of the Fusion event may be what it reveals about the extent, health and capabilities of AMD's ecosystem around general-purpose processing on graphics cores, Brookwood said.

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