Hillcrest Labs

<p>In March, Micron and Intel said they would be second to Samsung with ultra-dense 3-D NAND flash chips that will sell as chips and in SSDs; Micron will pack 256 Gbits into vertical NAND chips using two-bit per MLC technology and 384 Gbits in TLC versions. Samsung began shipping its 850 series SSDs using 86 Gbit MLC and 128 Gbit TLC chips using vertical NAND last July.</p>

The group of electrochemical sensors works with or without enzymes, which means the device can react to a wide range of compounds, and it can do so for several days or even weeks.

Passes for the ESC Boston 2015 Technical Conference are available at the conference’s official site with discounted advance pricing until May 1, 2015. The Embedded Systems Conference and EE Times areowned by UBM Canon.

 

FXUYP5E5EAAF239_Datasheet PDF

TAIPEI — ARM and United Microelectronics Corp. (UMC), the world’s second-largest chip foundry, announced Monday (May 18) what they say is the first availability of a new ARM Artisan physical IP platform on 55nm to accelerate embedded systems and Internet of Things (IoT) device development.

UMC is targeting its 55nm ultra-low-power (ULP) technology for energy-efficient IoT applications. The new physical IP offering will help chip design teams accelerate and simplify the implementation of ARM-based SoC designs for IoT and other embedded applications, the companies said in a press statement.

FXUYP5E5EAAF239_Datasheet PDF

The technology is targeted at wearable devices, UMC spokesman Richard Yu told EE Times. Wearables need ULP technology to prolong battery life because wearable products and sensors are in an always on” status, Yu said.

The Artisan physical IP platform is expected to help enhance UMC’s ULP technology to maximize power efficiency and reduce leakage, the companies said. Features such as thick gate oxide support and long, multi-channel library options are expected to give SoC designers multiple tools to help optimize IoT applications.

FXUYP5E5EAAF239_Datasheet PDF

A physical IP foundation platform at UMC’s 55ULP process technology is vital in enabling low-power and cost-sensitive designs for emerging IoT applications, according to Will Abbey, a general manager with ARM’s physical design group.

By delivering libraries optimized with features targeting power-efficiency, ARM and UMC are providing SoC designers with a comprehensive set of new tools,” Abbey said in a press statement.

Last week, Hewett-Packard tapped a startup for FPGA cards as an option in its Moonshot servers. However, Google researchers have so far been cool on the concept of FPGAs.

Next Page: Impact on embedded and foundry

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SAN JOSE, Calif. — Forget the 50 billion devices on the Internet by 2020 as preached by networking giant Cisco Systems. That over-quoted fantasy projection includes all PCs, smartphones, tablets and probably a few iKitchen sinks.

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The use of multiple secure domains will be useful in many applications. For example car makers could use a common GPU for separately secured dashboard, infotainment and driver assistance jobs. Imagination foresees SoC and system makers using OmniShield even for designs that use a mix of PowerVR and ARM or x86 cores.

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