GUILDFORD, England — Si-Light Technologies Ltd., a spinoff from the University of Surrey, located here, said it will investigate the application of dislocation engineering” to enable light emission from silicon at wavelengths between 1.1 to 1.6 microns.

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<p>Cornyn said the addition of the SIMD core will not break compatibility with the PowerPC BookE architecture, which was defined by both IBM Corp. and Motorola. Both companies had agreed that either could make certain changes as long as the core architecture is not altered, he said.</p>

GUILDFORD, England — Si-Light Technologies Ltd., a spinoff from the University of Surrey, located here, said it will investigate the application of dislocation engineering” to enable light emission from silicon at wavelengths between 1.1 to 1.6 microns.

Tyco International Ltd. said today it would divest its unprofitable Tyco Global Network and initiate a corporate restructuring program that would exit over 50 businesses, consolidate 219 facilities, and cut 7,200 employees.

Following through on previous promises to restructure its operations to generate cash and focus on core businesses, the Pembroke, Bermuda conglomerate said the businesses affected combined to produce $2.1 billion in revenue in fiscal 2003 ended September, about 6% of Tyco s revenue base.

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Tyco announced the actions as it reported a loss of $297.1 million, or 15 cents per share on revenue of $9.5 billion in its fourth 2003 fiscal quarter ended September, compared to a loss of $1.4 billion, or 72 cents per share on sales of $9.4 billion a year ago.

Tyco's Electronics Group reported an operating loss of $560 million on revenue of $2.65 billion, compared to a loss of $1.8 billion on revenue of $2.56 billion a year ago. Orders improved over a year ago with a slight revenue improvement in the connector business, offset by weakness in the automotive and telecom infrastructure related markets, according to Ed Breen, chairman and chief executive during a conference call with analysts.

Adversely affecting Electronics Group results was the dismal performance of the Tyco Global Network, an underseas fiberoptic communications network. Fourth quarter Electronics Group results included a $664 million write-down of the carrying value of the network and a $278 million goodwill impairment charge.

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Breen told analysts Tyco would continue to service and maintain the network while seeking a buyer. For the 2003 fiscal year ended September, the network had pretax losses of $117 million.

The other businesses being exited, which Breen did not specify, combined to generate $55 million in income in fiscal 2003.

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Tyco expects the restructuring actions to incur $400 million in charges in fiscal 2004, with total annualized savings estimated at $230 million by 2005.

SANTA CRUZ, Calif. — Providing a mixed HDL and C-based tool suite for FPGA designers, Aldec Inc. and Celoxica Ltd. this week (Nov. 4) are announcing Active-HDL+C. The offering combines Aldec's Active-HDL design entry and simulation with Celoxica's DK engine for C language synthesis and co-simulation.

The paper describes NMOS and PMOS transistors with physical gate lengths of 80-nm and an electrical oxide thickness of 1.4-nm (14 Angstroms), as measured at inversion. The threshold voltages of the devices were within Intel's targets, and drive currents and off currents were among the best reported to date, according to Intel.

Ken David, director of components research at the manufacturing group, said it is possible that Intel could switch gears at the 45-nm node, using a tri-gate transistor with silicon dioxide, or possibly with a high-k material, as the gate insulator.

But if Intel sticks with the conventional planar transistors, it is committed to using the high-k gate insulator and metal gates that it has identified, he said.

Rather than grow the insulation layer as is commonly done with silicon oxide, Intel will use atomic layer deposition (ALD) equipment to deposit the high-k materials, he said.

–additional reporting by Rick Merritt

Gadd said that Agilent too is integrating more functions into products such as power amplifier modules. We'll see more 3G CDMA infrastructure investment and expect demand for such handsets to pick up in 2005 or 2005,” he said.

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