ABB Embedded Power

<p>Hatim Zaghloul, chairman and chief executive of Wi-LAN, said that joint work with Philips began in June, when the two companies demonstrated dual full-motion MPEG-2 streams over unlicensed bands. The pact with Philips specifies a one-time license fee, plus royalties based on chip sales. Philips gains exclusive rights to the use of W-OFDM in consumer markets for one year, though Wi-LAN retains the rights to license algorithms to companies that do not compete with Philips.</p>

There is considerable demand for more-intelligent discretes, combining several components to perform a function rather than just offer protection, according to ST's Borghol.

The cPRO3 uses an Award BIOS in Flash ROM which allows future BIOS upgrades to be programmed on-site. The card has the I/O capabilities ofa complete PC/AT, offering two rear panel RS-232 serial COM ports, a parallel printer port, Ethernet port, dual USB ports and front panel keyboard/mouse port. The COM-2 serial port is enhanced for software-selectable RS-422 or RS-485 operation.

Pricing for the cPRO3 is $1,100 in OEM quantities.

solid state relay 5vdc


solid state relay 5vdc

Schroff North America (Warwick, RI – 401-732-3770) now offers 10-layer backplanes for CompactPCI applications that meet the PICMG cPCI 2.0 R2.1 spec. These new units completeSchroff’s family of VME, VME64X, cPCI and VXI backplanes.

The new 64-bit 3U, 6U and 7U high backplanes are available in four-, six- and eight-slot versions. Schroff has incorporated stiffening rails into the design to prevent bending when units are removed and replaced.

solid state relay 5vdc

The backplanes have a data transfer rate of 132 / 264 MBps, 220 pin metric connectors for hot-swap applications, right- or left-handed controller slots, integrated connectors for power supplies, and voltage I/O can be configured for +3.3Vor +5V. There are busbars on 5V, 3.3V and the Ground for optimum power distribution.


Intel Corp. today confirmed the delay of its Camino or Intel 820 chipset, while launching the 810E chipset and two related microprocessors.

A spokesman for Intel, Santa Clara, Calif., could not specify the scope of the Camino push out. The delay, the latest of two to afflict the device since its initial launch date last March, was blamed on memory integration errors, and we're working to determine the cause of these errors,” the spokesman said.

Sources at Intel's customers added that OEMs have not been told when to expect the Camino. In the interim, as expected, Intel launched the 810E chipset and 533- and 600-MHz versions of its Pentium III microprocessor.

As disclosed last week, the Camino errors cropped up in the last stages of the validation process, which involves testing by Intel and many of its customers. In certain motherboard configurations using three Direct Rambus DRAM memory modules-what the Intel spokesman called worst-case stress patterns”-certain memory errors occurred, the spokesman said.

In a report today, analyst Mark Edelstone of Morgan Stanley Dean Witter & Co., San Francisco, said that he believes the Camino chipset will be pushed out until the first quarter of 2000, although there is a possibility the chipset or some implementation of it will be released October 25, he said.


In response to those problems, Praegitzer has already shuttered its facility in Huntsville, Ala., and has announced plans to sell its facility in Malaysia. The company also said in its fiscal fourth-quarter earnings release last month that it is not in compliance with its loan covenants and is negotiating with its lenders to modify the terms of its credit lines.

Copyright © 苏ICP备11090050号-1 tl431 datasheet All Rights Reserved. 版权投诉及建议邮箱