Velleman

<p> The 3030, combined with this speed-optimized <i> WLAN Measurement Suite</i> software, is claimed to accelerate test times by a factor of five. The measurement suites will test all modulation formats of <i>IEEE-802.11a, IEEE-802.b</i> , and <i>IEEE-802.g</i> WLAN or GSM/EDGE devices, letting you make a variety of spectrum, modulation, and power measurements. </p>

Our investments in leading the industry shift to device software optimization are just beginning to produce measurable results,” said Ken Klein, Wind River chairman, president and CEO, in a statement. Our strong financial performance and significant progress on our product roadmap underscore our ability to deliver on our commitments — to our customers, to our stockholders and to our employees.”

At the age of 30, Nizam Ishmael has enough patents under his belt — 12 approved to date — to rank as one of the youngest engineers to attain IBM Corp.'s Master Inventor designation. Ishmael's ancestors emigrated from India to the South American nation of Guyana during the British colonial era. Ishmael spent part of his childhood in Queens, N.Y., before moving with his family to Lufkin, Texas, 150 miles north of Houston. He has been a Texan ever since. Now based at IBM's Austin facility, he travels widely, having taught courses on IBM's software products in a dozen nations. What started out as a conversation about software engineering with editor at-large David Lammers turned into a joy ride around Austin in Ishmael's 1998 Corvette.

EE Times: How did you get interested in cars?

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Nizam Ishmael: When I was a kid, we had a 1984 Caprice station wagon — a puke-brown color. I just had to learn how the engine runs. A cousin and I were always talking about the newest Ferrari coming out then. So when I got my job [at IBM in 1999], I looked around for a sports car. I wanted a stick [shift] that handled well. And I wanted something fast.

But I totaled my first Corvette. I wasn't used to a V8. I was going just fast enough — about 85 mph — so that when I hit some debris in the road, I lost it and hit a wall. I made an offer on eBay for another Corvette — I wanted another coupe either in silver or pewter. I made a lowball offer to a guy in San Diego for $20,000 that I never thought he would accept. He called me, and I drove it back from Los Angeles to Austin.

EET: (Inside the car, in IBM parking lot) How did you get started on these upgrades?

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Ishmael: I started racing the car at track events — at one point my girlfriend thought I was crazy, because I had 18 sets of tires in my garage. During that time I learned where the limits were in the car, which helps a whole lot. I do all the maintenance myself — I redid the suspension, put in new shocks, exhaust, sway bars. So I was going to all of these race events, and I wanted a way to record some of them. I thought it would be cool to get a camera in the car.

EET: You control that with this screen?

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Ishmael: That started when somebody bumped my car while it was at the airport for a few days. I wanted the camera to record while I'm not in the car. And there were other things I wanted to bring into the car. Vendors had MP3 players for cars, but they were really expensive, about $500 or $600. There was GPS for consumers back in 2002, but they were extraordinarily expensive — $3,000 to $4,000. I thought: How can I do all that without spending all this money and buying all these different things?” The answer was to put a computer in my car, because I knew that cameras and lower-cost GPS systems were around that could be connected to laptops.

EET: Does the computer run on your car battery?

Der Geschäftsmodell für Halbleiter-Fabs hat sich geändert”, sagte Ziebart. Bisher durchliefen die Fabs im Laufe ihrer Lebensdauer mehrere Nutzungsarten: Zunächst wurden dort Bausteine der neuesten Technologiegeneration gefertigt, nämlich DRAM-Speicherchips. Wurde die DRAM-Produktion unrentabel und auf eine andere, noch modernere Fab verlagert, so konnte die Fab weiter hochmoderne Logikchips herstellen, denn im Bereich der Logikchips und Standardbausteine erfolgte die Einführung der jeweils neuesten Technologiegeneration erst einige Jahre nach den DRAMs. Wurde dann auch für die Logikchips eine neue Technologie erforderlich, so konnte man die Fab immer noch für die Fertigung von Leistungstransistoren und Chips für die Automobilindustrie nutzen. Diese Abfolge verschiedener Nutzungsarten bezeichnete Ziebart als 'Kaskadenmodell'.

Das Kaskadenmodell ist aber künftig weniger wirksam”, so der Infineon-Kapitän. Neue Nodes entwickeln sich nicht mehr sequentiell in den verschiedenen Sparten der Halbleitertechnik, sondern parallel.” Beispielsweise werde der 90-Nanometer-Node praktisch gleichzeitig in der DRAM- und in der Logikherstellung eingeführt. Das macht es schwieriger, auf der Fertigungsseite Synergien zu erzielen.”

Bisher, so Ziebart weiter, seien die Marktchancen von Halbleiterprodukten stark von der Fertigungstechnik abhängig gewesen. Das triff heute aber in diesem Ausmaß nur noch für DRAMs zu”, erklärte der Manager. In wichtigen Marktsegmenten wie Automobilelektronik und Kommunikation sei es viel wichtiger geworden, ein teifgreifendes Verständnis für die technische Problematik des jeweiligen Kunden zu entwickeln. Die [Fertigungs]-Technologie steht dabei nicht mehr an erster Stelle”, resümierte Ziebart.”

Künftig will Infineon bei Logikbausteinen eine selektive Fertigungststrategie fahren. Die im Bau befindliche Fab im malaysischen Kulim werde Anfang 2006 Equipment ready” sein, Ende kommenden Jahres werde man die Fertigung anfahren. Ab dem 65-Nanometer-Node will Infineon bei der Fertigung auf Kooperationspartner wie die singalesische Foundry Chartered Semiconductors setzen; eine entsprechende Vereinbarung hatte das Unternehmen ebenfalls vergangenen Freitag bekanntgegegeben. Eine eigene 65-nm-Fab ist auf absehbare Zeit nicht geplant”, machte Ziebart klar.

Ähnliches gilt für die Entwicklung neuer Nodes. Wegen der immensen Kosten sei es für einzelne Unternehmen nicht mehr möglich, einen Node komplett selbst zu entwickeln”, so Ziebart.

LONDON — Mempile Inc., a startup developing removable storage technology, said Wednesday (Nov. 16) that is has secured $10.5 million in Series C funding, bringing the total invested in the company to $27.6 million.

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