Arndt Electronic

<p style=Several weeks after the first presentation of its F125 research car at the Frankfurt Motor Show, Daimler has provided details on the infotainment system in this futuristic car. It embraces elements such as cloud computing, seamless media integration, many apps as well as the new MirrorLink open infotainment interface.

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All these platforms look pretty competitive. Apple has never had such a tough competition and it won't get easier,” noted Pallenberg, though he said he remained confident Apple would still manage to post a record quarter. 

If you think you know all the vendors of LDOs, think again. NXP Semiconductors N.V. has entered the market for stand-alone LDOs for low-voltage, space-constrained applications such as smartphones, where numerous, local power regulators are sprinkled throughout the design.


Their wafer-level chip-scale packaged (WLCSP) LD6806CX4 measures 0.76 × 0.76 × 0.47 mm (0.4 mm pitch), and has just 60 mV of dropout while delivering up to 200 mA. As a result, it can support 2.9 V rails, even from a 3.0 V supply, such as needed for an SD card slot. (Lithium batteries provide voltages between 2.3 and 4.0 V, while most phones switch off” at around 3.3V.) This LDO series operates from input voltages from 2.3 to 5.5V and provides outputs from 1.2 to 3.6V.

Note that the LDO itself may, in use, be operating from a regulated supply—such as a DC/DC switcher—rather than a battery. Therefore, the LDO's second critical function is noise filtering of the supply rail, in addition to buck regulation. For this NXP LDO, the noise is just 30 µVrms (10 Hz to 100 kHz), eliminating the need for an external noise-reduction capacitor, while PSRR (power supply rejection ratio) is 55 dB.


In standby mode, current draw is 0.1 µA (typical). The diminutive size has not diminished its ESD or electrical robustness: the device meets the 10 kV HBM (human body model) standard, and includes thermal shutdown and current limiting.

Packaging, pricing, and availability : In addition to the WLCSP version, NXP offers a SOT886 leadless package that is 1.0 × 1.45 × 0.5 mm, and a SOT753 consumer package at 2.9 × 1.5 × 1.0 mm The LDO is priced at $0.23 (10k orders) and is available now.


For more information , go to or click here for a datasheet.

Mitsubishi Electric has announced a 10 Gbit/s optical transmission device that cuts power consumption by 50% compared to conventional models used for high-speed large-volume data transmission between data centers. Comprising an electro-absorption modulator laser (EML) coupled with a transmitter optical sub-assembly (TOSA), the module transmits up to a distance of 40 kilometers thanks to its high-quality signal performance.

ST's MEMS microphones pair perfectly with the latest generation of the Company's Sound Terminal audio processing chips that feature a dedicated built-in interface for direct connection of a MEMS microphone, saving parts count and cost.

The MP34DT01 is the second member in ST's high-end MEMS microphone family and new devices with best-in-class SNR and trimmable sensitivity for matching within 1dB, coupled with further size reduction, are in the pipeline for 2012 and 2013.

Already qualified by a top-tier cell-phone maker, ST's top-port MP34DT01 MEMS microphone is available in mass production, with unit pricing $1.42 in quantities of 1,000 pieces.

More information about ST's MEMS portfolio at .

This article originally appeared on EE Times Europe.

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