Macchina

<p> This conference will cover the increasingly inter-related areas of OpenAccess, Design for Manufacturability (DFM), Low Power design and the newest Coalition for Open PDKs. Updates on the industry adoption of OpenAccess will be presented along with status and plans for the future for all coalitions. Semiconductor companies and EDA vendors who have adopted Si2 standards will discuss their advanced capabilities and their experience. </p>

As part of the Digi X-Grid solution, the Web-services interface is available to any application provider. Therefore ERT metering information can be collected and presented by a wide range of existing Digi X-Grid application providers allowing utility companies to add new software partners as needed. Digi X-Grid solutions leverage Digi’s industry leading line of Smart Energy gateways, XBee ZigBee modules and iDigi platform to make it easy to connect directly to home energy devices.

SAN FRANCISCO—Nokia's N8 smarphone, which features a 12-megapixel CMOS image sensor, includes chips made by Synaptics Inc., Texas Instruments Inc., Broadcom Corp., Renesas Electronics Corp., STMicroelectronics NV, ST-Ericsson SA and Murata Manufacturing Co. Ltd., according to a teardown analysis performed by market research firm iSuppli Corp.

Despite dramatic differences in the designs, the NB carrier a bill of materials (BOM) cost nearly identical to iPhone 4, according to the teardown analysis. The N8's BOM cost is $187.47, according to the teardown analysis, just 4 cents less than an iSuppli teardown found to be the BOM of the 16-Gbyte version of the iPhone 4 in June.

HW-04-10-F-D-606-SM_Datasheet PDF

Andrew Rassweiler, principal analyst and teardown services manager at iSuppli, the N8's BOM is proof that Nokia is going after the touch-screen smartphone segment dominated by Apple. Although the two phones differ markedly in key areas, including the camera and the core silicon, both are designed to hit similar production cost budgets,” Rassweiler said.

Including about $9.50 to manufacture the N8, the total cost to produce the smartphone is about $196.97, iSuppli said. In the U.S., the N8 retails for $549 without a service contract.

While iPhones use conventional NAND flash, the N8 employees a slightly more expensive variant known as Embedded MultiMediaCard (eMMC), according to iSuppli's teardown. The analysis found Toshiba Corp. was the supplier of the eMMC NAND in the specific N8 examined by iSuppli, though the firm noted that memory is always supplied by multiple vendors.

HW-04-10-F-D-606-SM_Datasheet PDF

The N8 examined also carried additional OneNAND memory and DDR DRAM supplied by Samsung Electronics Co. Ltd., iSuppli said. Samsung Mobile Display is the supplier of the N8's Active Matrix Organic Light Emitting Diode (AMOLED) display, the teardown found.

Other component highlights of the N8 revealed by iSuppli include:

HW-04-10-F-D-606-SM_Datasheet PDF

SAN JOSE, Calif. – South Korea's Samsung Electronics Co. Ltd. beat analysts' estimates for the third quarter, but the company issued a warning about a pending DRAM glut in the marketplace.

As the folks at Altera said to me: If there's one image that tells this whole story, it's this one!” They were talking about the image shown below, and they were right!

As part of today's news, Altera unveiled it signed earlier this year an agreement with ARM Ltd. to license a range of technologies, including the Cortex-A9 microprocessor. Altera will deliver products that integrate hardened Cortex-A9 processor-based subsystems with 28-nm FPGA technology. More detailed information on these ARM processor-based devices will be made available in 2011.

Altera has also broadened its portfolio of soft processor cores and will introduce the MP32 soft processor core based on MIPS Technologies' MIPS32 processor architecture in early 2011. The MP32 is a result of close collaboration between Altera, MIPS Technologies and lead customers over the past year. It will complement Altera's Nios II embedded processor and the portfolio of partner soft CPUs available for Altera devices, and significantly extend the number of operating systems and the amount of application code available for use on FPGAs.

Later this quarter, Altera will deliver the Qsys system integration tool, as part of the Quartus II development software.  Incorporating the industry's first FPGA-optimized network-on-a-chip technology, Qsys will be able to offer memory-mapped and datapath interconnects that achieve nearly double the performance of Altera's SOPC Builder tool, while being able to support industry-standard IP interfaces, such as AMBA.

Qsys will leverage the easy-to-use interface of SOPC Builder and provide backwards compatibility for easy migration of existing embedded systems. Furthermore, this advanced interconnect technology will support hierarchical design, incremental compile and partial reconfiguration methodologies. More details on Qsys and the Embedded Initiative will be available later this quarter.

The investment will create 800 to 1,000 permanent high-tech jobs and 6,000 to 8,000 construction jobs, Intel (Santa Clara, Calif.) said. The new development fab in Oregon, to be known as D1X, is slated for R&D startup in 2013.

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