Meder

<p>Without EUV, they can’t deliver the same scaling advantage as past nodes,” said Mike Demler, an analyst with the Linley Group. If you look at N7+, they claim an additional 20% scaling over N7. So EUV is required to get closer to traditional Moore’s Law scaling. Their N5–N7 scaling just gets worse.”</p>

The embedded FPGA, designated EFLX4K, implements Flex Logix’ second-generation chip architecture also available at a range of process nodes from other foundries. The programmable chip is compatible with the company’s existing compiler.

By 2016, HIR got official sponsorships from three IEEE Societies: the IEEE Electronics Packaging Society (EPS), IEEE Electronic Devices Society (EDS), and IEEE Photonics Society. Semiconductor Equipment and Materials International (SEMI) and the American Society of Mechanical Engineers (ASME)’ Electronic and Photonic Packaging Division (EPPD) also signed up to work on HIR.

The wheels really started to churn last year. As the HIR group held workshops throughout the world to evangelize its mission, close to 1,000 scientists, researchers, and senior engineers showed up and pledged to participate in HIR,” said Bottoms. When it comes to its membership, We are keeping the quality of standards very high,” he stressed. We are picking only those with technical credentials and real commitment to contribute to each technical working group.” Typical marketing onlookers who just want to suck up information aren’t included, explained Bottoms.

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Bottoms defines the scope of the HIR as identification of the difficult challenges we need to overcome in meeting technical requirements for the next 15 years and 25 years for emerging research areas.” The group is developing a pre-competitive” roadmap, he noted. It’s far more efficient in pooling industry resources to chart the future instead of fragmenting efforts and diverging into too many directions. The HIR group sees the primary integration technology for potential solutions as complex SiP architectures.”

In many ways, Bottoms said that the industry has begun to see products in which silicon dice and non-silicon materials are together in one package. One good example of HI is Intel’s photonics optical transceivers,” he noted, in which Intel applied silicon wafer planar manufacturing technology to the volume manufacture of electro-optical transceivers.

Another example is what’s known as S2,” the second-generation SiP in the Apple Watch 2. Just like S1, these SiP modules mix package styles in one module. The module contains components that can be packaged as bare-die (CSP, WLP, etc.) or traditional wire-bonded packages, or even multi-chip configurations like package-on-package or a multi-die memory DRAM or NAND. Apple has pushed the SiP concept so far out into the future — a road nobody has taken before,” said Bottoms. TechInsights, in its Apple Watch 2 teardown, wrote, The S2 contains more than 42 die! That is a lot of silicon in such a small module.” Similarly, Bottoms was marveled at the 98 interconnects inside S2.

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Nothing pleases Lu more than the growing momentum behind HI. Heterogeneous integration is no longer just his passion, but is spreading throughout electronics, Lu told us.

Earlier this year, Lu gave a plenary talk entitled Synergistic Growth of AI and Silicon Age 4.0 through Heterogeneous Integration of Technologies” at an IEEE-organized event in Santa Clara. He told us, So many people came to see me after my speech. They were all so excited.”

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What’s so exciting? Lu’s talk wasn’t about the nuts and bolts of integrating heterogeneously. Instead, he described his focus as broadening the scope of research and development in the semiconductor industry.

Now that the chip industry is no longer hostage to continuous scaling, Lu believes that it can apply its knowledge to a larger mission. The next step, he says, is pervasive intelligence” enabled across different industries ranging from AI, human, and natural interface to bio, cells, bacteria, and medical intelligence.

I think that it's one of those things like when a team wins the Super Bowl,” Cook said Tuesday. Maybe you want them to win by a few more points. But it's the Super Bowl winner and that's how we feel about it. I could not be more proud of the product.”

Overall, Apple reported sales of $61.1 billion for its fiscal second quarter, an increase of 16 percent compared with the year-ago quarter and a decrease of 31 percent compared with the previous quarter. The company reported a profit of $13.8 billion for the quarter, up 25 percent year-over-year.

Apple said it expects sales for the current quarter to decline to between $51.5 billion and $53.5 billion, higher than most Wall Street estimates.

Apple sold 9.1 million iPads for about $4.1 billion during the fiscal second quarter, year-over-year increases of 2 percent and 6 percent, respectively. Mac unit sales declined to about 4 million, down 3 percent year-over-year, while Mac sales revenue was flat, Apple said.

It is becoming less likely that semiconductor acquisitions over $40 billion can be completed or even attempted in the current geopolitical environment and brewing battles over global trade,” IC Insights said in a press statement.

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