Crowd Supply, Inc.

<p> The Cortex-A9 is likely to be targeted at higher performance applications while the Cortex-A5 MPCore processor is the most energy efficient, lowest cost processor suitable for delivering the Internet to a range of devices from entry-level smartphones through to consumer and industrial devices.</p>

Renesas, the world's fifth largest chip company and its largest vendor of microcontrollers has lost approximately half its production capacity. The Renesas campus at Naka is without power and the company has not yet started to assess damage there. The company has a 300-mm wafer fab that made system LSIs and a 200-mm wafer fab that made microcontrollers.

4G/LTE chips coming . . . but first, a little chaos

LONDON – Hynix Semiconductor Inc. has announced that it has developed a 2-Gbit DDR4 DRAM IC and 2-Gbyte memory module based on the IC. The IC has been implanted using a 30-nm class (somewhere between 30 and 39-nm) manufacturing process technology.

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The module includes error check and correction (ECC) and is to the small outline dual-in-line memory module (SODIMM) format. It is intended for use in small server computer. Hynix said it plans to start volume production of this DDR4 product in the second half of 2012.

Hynix claimed that the 2,400-Mbits per second achievable by the memory IC is the fastest yet demonstrated, beating the 2,133-Mbps at 1.2-V claimed by rival memory maker Samsung Electronics Co. Ltd. It is also 80 percent faster than Hynix's own DDR3 1,333-Mbps product. The DDR4 DRAM standard should allow lower power consumption while doubling the rate at which data is transferred from the DDR3 standard.

The Hynix DDR4 memory module product operates at voltages down to 1.2-V and processes up to 19.2-Gbytes of data per second with a 64-bit I/O, Hynix said.

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With this product, Hynix will be able to provide premium solutions to our customers not only in the PC and server but also in the tablet market,” said Ji-Bum Kim, chief marketing officer of Hynix, in a statement.

DDR4 DRAM is expected to increase from 5 percent of the market in 2013 to over 50 percent in 2015, Hynix said referencing market research firm, IHS-iSuppli. Demand for DDR3 DRAM is expected to reach its peak in 2012 with 71 percent of the market and then decrease to 49 percent of the market in 2014.

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Related links and articles: Samsung trials DDR4 DRAM module

Rambus targets DDR4 DRAMs

Sequans announced the establishment of its LTE program in 2009. Sequans disclosed that Alcatel-Lucent and Motorola had invested in its LTE development program. Recently, Sequans announced that China Mobile had selected Sequans to provide LTE chips and USB dongles for its TD-LTE demonstration network.

New Venture Research has released a report analyzing the merchant embedded computing market from 2002 to 2015. According to the report, although there are several hundred companies, most are fairly small in revenue and highly specialized, focusing on specific application segments with unique product requirements.

The report tracks and analyzes five application markets, nine bus architectures and four form factors. Specific trends and issues of the forecast by application, bus architecture and form function are covered in detail.

According to the report, while the overall MEC market is slowly recovering from the 2009 economic meltdown, the performance of various market segments, bus architectures, and companies will recover at different rates. Total revenue was just under $5 billion in 2010, a 4 percent increase from 2009 revenue, which had a 12-14 percent decrease over 2008. If the worldwide economies stabilize, the MEC industry will likely recover at about 6 percent in 2011 to about $5.2 billion.

The report says the wireless communication segment is being driven by smartphone traffic, with 3G/4G services representing the gold mine for carriers going forward. At the same time, the wireline and optical networks are gearing up for upgrades to support increasing traffic.

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